| Nayana Ghantiwala |
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| nayana@alum.mit.edu | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EDUCATION | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Massachusetts Institute of Technology - M.I.T. * B.S. Mechanical Engineering, 1996. * Member of MIT Pi Tau Sigma National Mechanical Engineering Honor Society. U.C. Berkeley - Professional Extension * Introduction to Statistics, Spring 2002 (Redwood City) * Thermal Management of Electronics Systems and Packages, October 2000 (Redwood City) * Introductory French, Spring 2001 (Atherton) * BioMEMS (Biomedical MicroElectroMechanical Systems) Seminar, June 2000 (Berkeley) * Bioinformatics Infrastructure, Spring 2000 (Fremont) * Recombinant DNA Technology, Fall 1998 (Redwood City) * Drug Discovery & Trends, Fall 1998 (San Francisco) New England Biolabs * PCR & Molecular Biology Summer Workshops, Smith College, 1999 Silver Creek High School * Graduated Valedictorian, 1992. LeyVa Junior High School * Graduated Valedictorian, 1988 |
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| WORK EXPERIENCE | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HEWLETT-PACKARD COMPANY Cupertino, CA October, 2007 to Present: Senior Thermal Systems Engineer, Voodoo Gaming Business Unit. September 2000 to July 2002: Thermo-Mechanical Hardware Engineer, R&D Network Server Division. |
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| Design Analysis & Development | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| * Built three-dimensional thermal CFD (computational fluid dynamics) system models of electronics packages in Icepak and Flotherm to determine optimal cooling design concepts for high density 1U rack mounted servers and high-end gaming PC systems. * Designed air cooled heatsinks for Intel Pentium III (Coppermine/Tualitin). * Design liquid-cooled systems for Xeon Dual / Quad Core (Kentsfield, Yorkfield, Bloomfield) and Nvidia Graphics cards (GTX-280 / D10U-30 and D9E-40), and AMD (ATI) Graphics cards (R680). * Manage liquid cooled reliability testing and suppliers by working with labs and commodity managers. * Manage thermal, acoustics, power testing of all high-end gaming systems. * Tested system cooling fans during chassis development. * Characterized resistance of grease and phase change thermal interface materials for heatsink applications. * Measured component temperatures with thermocouples and box airflow on flowbench. * Surveyed low cost heatsink vendors based on manufacturing technologies for high volume production. * Tracked acoustics data on competitors. * Created spreadsheet tool to calculate temperature rise and airflow requirements based on maximum power dissipation and altitude. * Protected intellectual property during heatsink development with vendors. * Generated design concepts for 20 kW heat load simulator which saved $160,000 in rack tests. * Designed test flow chart and rack power specs for Utility Data Center. |
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| Leadership | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| * Successfully negotiated with Intel IA32 processor team to deliver characterized chips to improve thermal design accuracy. * Managed technical work of summer intern and conducted design reviews of racked thermal test unit. Integrated input from all project stakeholders (Manufacturing, Marketing, Mechanical Design, Electrical, and Competitive Analysis). * Connected DreamWorks-SKG customer to HP Labs for data center consultation which resulted in 3-year hardware contract. * Led cross-functional technical discussions and integrated product designs from electrical and mechanical engineers, project managers, System teams, HP Corporate R&D lab, product architects, and Intel?s technical staff to deliver systematic thermal test strategy, measurement methodology, metrology, simulation tools, and optimized software utilization models. * Advised mechanical product designers on components. * Participated in power supply efficiency workshop discussions with PG&E and EPA. |
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| ODM/OEM Partner Management | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| * Advised HP management teams and senior Electrical Engineers on product life and component issues. Escalated resource issues to management. * Reviewed and wrote test plans to build confidence in partner?s product. * Summarized thermal performance of chassis components. * Reviewed Intel?s Monte-Carlo probability analysis for processor temperature. * Conducted technical design review of Taiwanese design partner?s research. * Audited lab techniques of Taiwanese team as Lead Thermal Engineer in March, 2001. * Conducted thermal design reviews at Intel in Oregon in March, 2002. * Conducted thermal design reviews at ODM sites on 3 projects in Taipei in February, 2008. * Provide feedback to Intel FAE's on HP roadmap, 2008. |
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| APPLE Cupertino, CA July 2002 to September 2007 Thermal Architect, Product Design. Xserve (1U server), MacPro (G5/Intel Desktop), 30" Cinema Display, XRAID (3U) |
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| * Defined, simulated, tested award winning products. All designs were leveraged for many years thereafter. * Awarded US patent #6,968,890 for a high heat flux heatsink. |
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| APPLIED BIOSYSTEMS Foster City, CA August 1998 to September 2000 R&D Mechanical Systems Engineer. Polymerase Chain Reaction & Sequence Detection Systems (PCR-SDS). |
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| * Worked with Sr. Mechanical, Electrical, Firmware, and Systems Engineers to design parts, develop concepts, analyze data, prototype systems, simulate models and integrate new automated thermal cyclers. The instruments automate the replication process of DNA through PCR by using specific primers at standard protocol temperatures. * Designed experiments to characterize and evaluate thermal and electrical system performance of Applied BiosystemsGeneAmp Thermal Cycler technology by acquiring data from thermocouples, RTDs, thermistors, and serial data ports. Used Labview DAQ. * Derived Peltier thermoelectric power equations for current, voltage, and resistance based on material and geometric relationships. Worked with Firmware Engineer to implement dynamic thermoelectric system equations into a software simulator for real-time power control of Peltier devices. * Specified and integrated product components such as heat-sink, fan, Peltier thermoelectric cooling devices, and power supply to demonstrate feasibility of thermal cycler product before manufacturing. Used Tektronix oscilloscope, Omega thermometer, Omega flowmeter, Fluke DMM, Eutechnics 0.2mL temperature probe, and Labview DAQ systems to analyze power, current, voltage, temperature, flowrates, heating and cooling rates of thermoelectric devices. * Solved coefficients to curve fit resistance errors from the Steinhart-Hart equation used in thermistor temperature calibration. * Tested and verified firmware control of automated thermal cyclers. * Implemented mechanical hardware changes with Pro/Engineer. Submited drawings to Pro/PDM. Example: Gold Block * Used Labview to develop and integrate automated temperature calibration and uniformity measurement system with Manufacturing team and thermal sensor vendor. * Traveled to Singapore manufacturing facility in July 2000 for thermal performance test evaluation. * Evaluated several key thermal cycler prototype systems: |
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| * Micro-Card for DNA Sequence Detection Systems, * GeneAmp 2700 for low cost and high volume market, * Aclara Biochip for PCR compatibility. |
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| * Released technical engineering reports and presented product development progress in R&D Reviews to Marketing and Management. * Created analytical heat transfer models to evaluate cooling electronics through CFD (computational fluid dynamics) software packages. * Selected and coordinated facilitization of temperature/humidity environmental chamber for R&D Lab. |
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| DESIGN CONTINUUM, INC. West Newton, MA March 1998 to July 1998 Mechanical Engineer. |
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| * Involved with products and concepts under non-disclosure agreements for clients on cross-functional design teams which include Sr. Mechanical, Electrical, and Product Designers. * Responsibilities included plastics part design with 3D solid and surface models in Pro/Engineer, concept development, ideation, product strategy, and presentation preparation. * Clients: BMW, SEGA, Moen, Varian, Millipore. |
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| APPLIED MATERIALS, INC. Santa Clara, California July 1996 to February 1998 Mechanical Design Engineer |
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| Metal Deposition Product Business Group Business Development Engineering (BDE) |
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| * 100+ hours of semiconductor process & hardware training on HP Endura PVD Responsibilities include: |
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| * process characterization * designing process parts with Pro/Engineer & Pro/Mechanica * in-house analysis of field generated issues |
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| Project highlights: | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| * PreCleanII Resonator Rotation vs. Etch Uniformity * Wafer Deflection with Backside Gas - Pro/Mechanica Model * Full Face Capacitance-Voltage Metal Mask * Robot Blade Laser Measurement Tool * HTHU Heat Shield Retrofit Kit * BST Shield Conversion |
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| New College Graduate Program | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| * 225+ hours of technical process & Human Resource developmental training. Manufacturing: Chemical Mechanical Polishing (CMP). * CMP Module Assembly Procedure Verification: Worked with Manufacturing and Test Engineers to modify and create documentation for final subassembly test procedures. Engineering: High Temperature Films (HTF). * Centura HT Product: Developed 3D kinematic model of susceptor support shaft eccentricity. * Involved in new silicon nitride ceramic ball bearing evaluation. * Documented rotation rebuild procedure. Field: AIGIS Installed Base Support Services (IBSS). * Tracking of Non-Conformances with DataSource v.2.3. * Quantified and consolidated Software Performance Report data on software enhancement requests. * Interviewed Customer Engineers at NEC semiconductor fabsite in Roseville, CA. |
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| MIT D'ARBELOFF LABORATORY FOR INFORMATION SYSTEMS & TECHNOLOGY Cambridge, Massachusetts September 1995 to February 1996 The Total Home Automation and Health Care Consortium Project Supervised by Dr. Ian W. Hunter Bachelor's Thesis Topic: Automated PC-Based Cardiovascular Fitness Monitoring System for the Elderly. |
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| Programmed GUI in MS Visual Basic 4.0 for Windows95 to run 16-bit IOTech Data Acquisition system which monitored dynamic forces & pressure distribution from Omega compression beam load cells mounted to a vehicle seat assembly. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| FORD MOTOR COMPANY Plymouth, Michigan June 1995 to August 1995 Automotive Components Division, Climate Control Operations, Sheldon Road Manufacturing Plant Summer Intern. |
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| * Analyzed cycle times of the assembly lines * Managed project for automatic bar code labeling process * Worked with Industrial & Process Engineers to modify current work standards, process sheets, budget, plant labor expenses, and AutoCAD line layouts. |
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| HUGHES SPACE & COMMUNICATIONS El Segundo, California June to August 1994 Division of GM Hughes Aircraft Company, Propulsion Department BS CO-OP Intern. |
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| * Assisted Propulsion System Engineers in the High-Bay with latch valve testing, thruster functionality, and data acquisition of Apstar-2 and Optus B-3 satellite programs. * Designed action item database of frequently asked questions on the propulsion subsystem with MS Access 2.0. * Provided technical support on Internet access and delivered multi-media presentation on connectivity and networking environment. |
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| MIT SOLAR ELECTRIC VEHICLE TEAM Cambridge, Massachusetts February 1994 to June 1996 Mechanical Design Team. Manta Project: |
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| * Designed & manufactured carbon fiber composite rear fairing. * Involved in fiberglass composite mold & body construction. * Created AutoCAD drawings of hub-axle assembly. * Optimized chassis dimensions using truss analysis software package. * Designed & machined spyder (hub-sprocket interface) in drive train. |
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| Tested & Raced: | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| * 1994 American Tour de Sol Commuter Race, New York City to Philadelphia, First Place * 1995 Sunrayce, Indianapolis to Golden Colorado, First Place |
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| MIT INFORMATION SYSTEMS Cambridge, Massachusetts October 1993 to June 1996 Distributed Computing and Network Services (DCNS) Residential Computing Consultant. |
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| * Member of DCNS team which provided technical support and configured personal computers with internet protocol for MITnet within the dormitory system. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MIT EDGERTON LABORATORY Cambridge, Massachusetts March to May 1993 Research Assistant. |
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| * Analyzed rapid events in real time with KODAK Ektapro Hi-Spec Motion Analyzer. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HONORS | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| * Awarded U.S. Patent #6,968,890 for a high heat flux heatsink. * Awarded 5 year service plaque at Apple, signed by Steve Jobs. * Awarded U.S. Patents #6,096,404 on 8/1/00 and #6,030,513 on 2/29/00 for design of Full Face Mask for Capacitance-Voltage Measurements (Filed 1/14/98 and 12/5/97 by Applied Materials PVD Metal Deposition Product Business Group) * Science Achievement Award, April 1999, PTSA (Parent-Teacher-Student Association) * 1999 Science Symposium, Keynote Speaker, Silver Creek High School * 1994 MIT Course 2.70 Robo-Soccer Quarter Finalist (top 8 of 200 entries) * 1994 MIT Mechanical Engineering Silent Hoist & Crane Wunsch Foundation Award, Department Honor for Inspiring Performance in Course 2.70 * MIT Pi Tau Sigma Mechanical Engineering Honor Society, 1994 Inductee, 1995 Alumni Chair * 1993-96 MIT Dawes Scholar * 1992-93 MIT Northern California Alumni Scholar * Memberships: |
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| * MIT Club of Northern California * Society of Women Engineers * American Society of Mechanical Engineers * Alpha Chi Omega Sorority, MIT Theta Omicron Chapter |
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| High School Achievements and Scholarships: | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| * Society of Women Engineers, Santa Clara Valley Section Scholarship * California Society of Professional Engineers, Award * MIT Club of Northern California, Alumni Scholar Award * U.C. Berkeley Alumni Leadership Award, Scholarship * USC Dean's Scholarship * California School Employees Association, Scholarship * Alexian Brothers Professional Staff Award, Scholarship * Bank of America Achievements Award, Mathematics & Science * East Side Union High School District, "Go For It" Scholarship * Elk's Foundation, Scholarship * Asian-American Circle K, Scholarship * 1992 Santa Clara County Youth Hall of Fame, Inductee * 1992 Silver Creek Academic Decathlon Team Member * 1992 National Honor Society - Silver Creek High's Lideres Chapter, President, Scholarship * California Scholarship Federation, Jr. V.P., Life-Time Member * Tandy Technology Scholar * Golden State Examination, Geometry, Honors * East Side Union High School District Mathematics Field Day * Calculus-6th Place (1991), * Mad-Hatter, 8th Place (1992) * Presidential Academic Fitness Award, LeyVa Junior High and Silver Creek High * Standard & Advanced First Aid Competitions, West Coast First Place, Team Captain, 1991-92 * Medical Explorer Post, President, 1991-92 * Westinghouse Science & Engineering Explorer Post, Participant * Alexian Brothers Hospital Volunteer Board Member, Food Services Chair * San Jose Mercury News, Science & Medicine Section, p. C1 (photo), 2/13/90, Kids Rise to Challenge - Mars Tomorrow * KQED's Vacation Video, Action Kid Minutes and Out & About video action spots * Perfect Attendance, 1988-92 |
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| Junior High School Achievements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| * Department Awards in Computer Science, Social Studies, and Art * Time Magazine, Nov 3 1986, p. 88 (photo), All-girl computer club * Perfect Attendance Award, 1986-88 * Girl Scouts, Silver Award, 1987 * LeyVa Jr. High Science Fair, First Place, 1987 & 1988 |
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| TECHNICAL SKILLS | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Computer Experience: | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CAD: Pro/Engineer WF3, 2000i, V.20 CAD: Solidworks 2007 (Basic training certificate in Parts & Assemblies) FEA: COSMOS (Basic training certificate in Design/STAR) CFD: Flomerics Flotherm Versions 7.1, 3.2, 3.1, 2.2, 2.1 (thermal CFD package for electronics cooling analysis) CFD: Fluent Icepak 4.3.10, 4.0, 3.2, 3.0 (thermal CFD package for electronics cooling analysis) FEA: Pro/Mechanica Structure & Thermal V.18 CAD: AutoCAD LT2000i, 2000, R13, R12 DAQ: LabView 5.1 DAQ (data acquisition systems) MIT: Mastercam Mill, Matlab, Adobe FrameMaker4.0 Microsoft Office: Visual Basic 4.0, Word 2003, PowerPoint 2003, Access 2.0, Excel 2003, Outlook 2003 Applied Materials: HP WorkManager - PDM, MM/3000, PVDCES Database Apple: Radar SW/HW Bug Database, Meeting Maker, FTP Transmit HP: IMS (Issues Management System) Operating Systems: Windows XP, Vista, 2000, 95, Mac OS X, DOS, C, UNIX, TCP/IP networking protocols Web: Basic HTML, Yahoo Page Builder 2.61.90 |
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| Machining Experience: lathe, CNC router, drill press, bandsaw, Bridgeport. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PROFESSIONAL REFERENCES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Chandrakant Patel, Hewlett-Packard, Director & HP Fellow, HP Labs, chandrakant_patel@hp.com Cullen Bash, Hewlett-Packard, Senior Researcher, HP Labs, cullen_bash@hp.com Michael Eng, Apple Computer, Senior Manager, Xserve, meng@apple.com Dr. Adrian Fawcett, Applied Biosystems, PCR-SDS R&D Manager, fawcetan@appliedbiosystems.com Dr. Peter Lundberg, Applied Biosystems, PCR-SDS Director of Engineering, lundbepl@appliedbiosystems.com John Egermeier, Applied Materials, Director of Global Applications Lab, john_egermeier@amat.com Dr. Anna Thornton, MIT Mechanical Engineering Professor,acthornt@mit.edu Dr. Ian Hunter, MIT Mechanical Engineering Professor, ihunter@mit.edu Dr. Woodie Flowers, MIT Mechanical Engineering Professor, flowers@mit.edu |
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| Last modified: July 5, 2008 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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